The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface

W/Cu joining is key for the fabrication of plasma-facing compounds fusion reactors. In this work, W and Cu are joined through three steps: (1) hydrothermal treatment reduction annealing (i.e., nano-treatment), (2) plating in a pure H2 atmosphere, (3) bonding at 980 °C 3 h. After nano-treatment, nanosheets structure can be found on substrate surface. The tensile strength joint prepared via nano-treatment reaches as high approximately 93 MPa, which increases by about 60% compared with one without nano-treatment. microhardness curves exhibited continuous variations along interface. TEM images show that interface compact any cracks or voids. This work may also applied enhancing other immiscible materials.